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High Precision K-sensor Mobile Phone BGA Reballing Station with 7' HD Color Touch Screen

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High Precision K-sensor Mobile Phone BGA Reballing Station with 7' HD Color Touch Screen

Name: High Precision Ksensor Mobile Phone BGA Reballing Station with 7 HD Color Touch Screen
Brand: HSTECH
Price: 1 USD

Buy cheap High Precision K-sensor Mobile Phone BGA Reballing Station with 7' HD Color Touch Screen product

Brand Name : HSTECH

Model Number : HS-700

Certification : CE

Place of Origin : China

MOQ : 1 set

Price : Negotiable

Payment Terms : T/T, Western Union, MoneyGram

Supply Ability : 100 sets per month

Delivery Time : 7~9 work days

Packaging Details : Wooden package

Product Name : Mobile Phone BGA Rework Station

Warranty : 1 Year

Control : Touch screen

PLC : MITSUBISHI

Relay Brand : Schneider

Optoelectronic Switch : OMRON

Material : Aluminum Alloy

Condition : New

Thickness : 0.3 - 5mm

Signal : SMEMA

Application : Electronic Assembly

Color : Silver

Control System : PLC

OEM/ODM : Available

Total power : 2600W

Power Supply : AC220V

Air Pressure : 4-6bar

Mounting accuracy : ±0.01mm

Type : Automatic

Weight : 30KG

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5 Modes Stepping Motor CCD Color Align System Mobil Phone BGA Rework Station

Specification

Mobile Phone BGA Rework Station	Model:HS-700
Power Supply	AC 100V / 220V±10% 50/60Hz
Total power	2600W
Heater power	Top heater 1200W(Max), bottom heater 1200W(Max)
Electric material	Driving motor + smart temp. controller + color touch screen
Temperature control	high precision K-sensor+ closed loop control + independent temp.controller (the precision can reach ±1℃)
Sensor	1pcs
Locating way	V shape PCB support + external universal fixture + laser light for centering and positioning
Overall dimension	L450mmW470mmH670mm
PCB size	Max 140mm160mm Min 5mm5mm
BGA size	Max 50mm50mm Min 1mm1mm
Applicable PCB thickness	0.3 - 5mm
Mounting accuracy	±0.01mm
Weight of machine	30KG
Mount chip weight	150g
Working modes	Five: Semi-auto/Manual/Remove/Mount/Weld
Usage Repair	chips / phone motherboard etc

Repair steps

1.Separate the BGA chip from mother board –we called desoldering.
2.Clean Pad.
3.Reballing or replace a new BGA chip directly.
4.Alignment/Positioning – Depend on experience ,silk frame ,optical camera.
5. replace a new BGA chip - we called Soldering hot air smd rework station iphone ic replace machine.

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High Precision K-sensor Mobile Phone BGA Reballing Station with 7' HD Color Touch Screen Images

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